3M™ Diamond Pad Conditioner
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Details
Highlights
- Optimized for extended pad and disk life
- Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
- Customizable for conditioning aggressiveness
- Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.
Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
Specifications
Resources
Related Products
| Carrier Diameter (Metric) | 107.95 mm, 95 mm, 101.6 mm | ||
| CMP Process | PMD/ILD, W (Bulk), Cu (Bulk), STI Process, Final Buff, Cu (Barrier), Hard Disk Drive Media Polishing, W (Buff) | ||
| Diamond Size | 251 micron, 74 micron, 90 micron, 151 micron, 181 micron, 63 micron |
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