- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
Details
Highly engineered pad conditioners deliver reliable performance offering excellent diamond retention, with controlled diamond placement and protrusion for critical semiconductor CMP applications.
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
Specifications
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|
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|---|---|
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Abrasive Working Surface
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Segmented
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Applications
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CMP
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Carrier Colour
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Grey
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Carrier Format
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Bar
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Carrier Size
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111.63 inch length x 0.85 inch height
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Carrier Substrate
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316 SS
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CMP Process
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Cu (bulk), W (bulk)
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Diamond Size
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251 um
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Diamond Type
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Type 2, blocky
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Manufacturing Location
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United States
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Mineral Type
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Nickel based alloy with patterned diamond
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Product Series
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R400
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