Highly engineered pad conditioners deliver reliable performance offering excellent diamond retention, with controlled diamond placement and protrusion for critical semiconductor CMP applications.
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Abrasive Working Surface
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Segmented
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Applications
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CMP
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Carrier Colour
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Grey
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Carrier Format
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Bar
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Carrier Size
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111.63 inch length x 0.85 inch height
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Carrier Substrate
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316 SS
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CMP Process
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Cu (bulk), W (bulk)
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Diamond Size
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251 um
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Diamond Type
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Type 2, blocky
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Manufacturing Location
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United States
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Mineral Type
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Nickel based alloy with patterned diamond
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Product Series
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R400
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