Sondhi™ Rapid-Set Indirect Bonding Adhesive allows you to use indirect bonding for more accurate bracket placement, less chair time, and reduced bond failures.
The Sondhi™ Rapid Set Indirect Bonding Adhesive is revolutionary from every angle.
This lightly filled resin is designed to complement our APC™ Adhesive Coated Appliances and cures in half the time (2 minutes vs. 4 minutes) of other indirect adhesives, while achieving two thirds of its bond strength within the first five minutes.
Any way you look at it, indirect bonding is superior with the Sondhi Rapid Set Indirect Bonding Adhesive.