Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
Optimized for extended pad and disk life
Diamonds secured with both chemical and mechanical bonds for superior retention
Controlled diamond placement and protrusion for consistent and reliable performance through disc life
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.