3M™ Diamond Pad Conditioner Ring E187, 260-mm dia

  • Part Number E187
  • 3M ID 60020012419

Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership

Optimized for extended pad and disk life

Diamonds secured with both chemical and mechanical bonds for great retention

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Carrier Diameter (Metric) 260 mm
CMP Process Cu (Bulk), PMD/ILD, W (Bulk)
Diamond Size 181 micron

Details

Highlights
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

Specifications