3M™ Diamond Pad Conditioner Ring E187, 260-mm dia

3M ID 60020012419

Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership

Optimized for extended pad and disk life

Diamonds secured with both chemical and mechanical bonds for great retention

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Highlights

Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
Optimized for extended pad and disk life
Diamonds secured with both chemical and mechanical bonds for great retention
Controlled diamond placement and protrusion for consistent and reliable performance through disc life

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.