- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
- Controlled diamond placement and protrusion for consistent and reliable performance through disc life
Details
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
- Controlled diamond placement and protrusion for consistent and reliable performance through disc life
Specifications
|
|
|
|---|---|
|
Abrasive Working Surface
|
Segmented
|
|
Aggressiveness
|
70-90
|
|
Applications
|
CMP
|
|
Brand
|
3M™
|
|
Carrier Colour
|
Grey
|
|
Carrier Format
|
Ring
|
|
Carrier Material
|
304 Stainless Steel
|
|
Carrier Size
|
10.24 inch diameter
|
|
Carrier Substrate
|
304 SS
|
|
CMP Process
|
Cu (bulk), PMD/ILD, W (bulk)
|
|
Diamond Size
|
181 um
|
|
Diamond Type
|
Type 4, semi-sharp
|
|
Manufacturing Location
|
United States
|
|
Mineral Type
|
Nickel based alloy with patterned diamond
|
|
Product Series
|
E187
|
