Engineered CMP pad brushes are designed for critical semiconductor buff CMP applications.
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Abrasive Working Surface
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Full Face
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Applications
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CMP
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Brand
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3M™
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Bristle Diameter
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0.012 in
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Brush Material-Density
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Nylon, >1200/sq in
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Carrier Colour
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Black
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Carrier Format
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Disk
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Carrier Material
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Polycarbonate
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Carrier Size
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4.25 inch diameter
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Carrier Substrate
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Polycarbonate
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CMP Process
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Cu (barrier), Final Buff, W (buff)
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Manufacturing Location
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United States
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Mineral Type
|
Nylon Fibers
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Product Series
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PB52A
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Product Type
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Pad Conditioner Brush
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