- Exclusive polymer substrate enhances corrosion resistance
- Durable brush bristles assist with removal of pad debris from porometric and felt-based pads
- Easy connection to polishing tool end effector
Details
Engineered CMP pad brushes are designed for critical semiconductor buff CMP applications.
- Exclusive polymer substrate enhances corrosion resistance
- Durable brush bristles assist with removal of pad debris from porometric and felt-based pads
- Easy connection to polishing tool end effector
Specifications
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|
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|---|---|
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Abrasive Working Surface
|
Full Face
|
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Applications
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CMP
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Brand
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3M™
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|
Bristle Diameter
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0.012 in
|
|
Brush Material-Density
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Nylon, >1200/sq in
|
|
Carrier Colour
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Black
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|
Carrier Format
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Disk
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|
Carrier Material
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Polycarbonate
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|
Carrier Size
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4.25 inch diameter
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|
Carrier Substrate
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Polycarbonate
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CMP Process
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Cu (barrier), Final Buff, W (buff)
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|
Manufacturing Location
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United States
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|
Mineral Type
|
Nylon Fibers
|
|
Product Series
|
PB52A
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Product Type
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Pad Conditioner Brush
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