3M™ Diamond Pad Conditioner A272, 4.25 in diameter
- Part Number A272
- 3M ID 60020021212
Specifications
Details
Highlights
- Optimized for extended pad and disk life
- Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
- Customizable for conditioning aggressiveness
- Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.
Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
Resources
Related Products
| Abrasive Working Surface | Ring Face | |
| Applications | CMP | |
| CMP Process | STI Process | |
| Carrier Diameter (Metric) | 107.95 mm | |
| Carrier Form | Disc (Beveled Edge) | |
| Carrier Material | 304 Stainless Steel | |
| Diamond Size | 63 micron | |
| Mineral Type | Nickel-based Alloy with Patterned Diamond | |
| Product Series | A272 | |
| Product Type | Diamond Pad Conditioner |
