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  6. 3M™ Trizact™ Pad Conditioner, B75-2990-5S2, 4.25-in dia

3M™ Trizact™ Pad Conditioner, B75-2990-5S2, 4.25-in dia

  • Part Number B75-2990-5S2
  • 3M ID 60020021352

3D microreplicated structures help manufacturers deliver precision and control for unique requirements

Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life

Metal-free composition is ideal advanced node processes sensitive to contamination

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Frequently viewed resources
Tech Data Sheet (PDF, 169KB)
Carrier Diameter (Metric) 107.95 mm
CMP Process Cu (Barrier)

Details

Highlights
  • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
  • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
  • Metal-free composition is ideal advanced node processes sensitive to contamination
  • Outstanding disk-to-disk consistency for predictive performance

3M™ Trizact™ Pad Conditioners deliver precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). Diamond-coated ceramic construction is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives.

  • microcopic close up on trizact CMP pad conditioner pattern of microreplication

    Microreplication – when consistency and precision really matter

    Featuring precisely-shaped, three-dimensional abrasive structures, 3M™ Trizact™ CMP pad conditioners are ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication – a core 3M technology applied to advanced node semiconductor manufacturing – these structures are reproduced uniformly across the Trizact™ CMP pad conditioner surface. What's more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.

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Specifications

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