3M™ Trizact™ Pad Conditioner, B75-2990-5S2, 4.25-in dia
- Part Number B75-2990-5S2
- 3M ID 60020021352
Specifications
Details
Highlights
- 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
- Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
- Metal-free composition is ideal advanced node processes sensitive to contamination
- Outstanding disk-to-disk consistency for predictive performance
3M™ Trizact™ Pad Conditioners deliver precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). Diamond-coated ceramic construction is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives.
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Microreplication � when consistency and precision really matter
Featuring precisely-shaped, three-dimensional abrasive structures, 3M� Trizact� CMP pad conditioners are ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication � a core 3M technology applied to advanced node semiconductor manufacturing � these structures are reproduced uniformly across the Trizact� CMP pad conditioner surface. What�s more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.
Resources
Related Products
| Abrasive Working Surface | B75-2990 Pattern | |
| Applications | CMP | |
| Brands | Trizact™ | |
| CMP Process | Cu (Barrier) | |
| Carrier Diameter (Metric) | 107.95 mm | |
| Carrier Form | Disc | |
| Carrier Material | Stainless Steel | |
| Mineral Type | CVD coated ceramic | |
| Product Series | B75-2990 | |
| Product Type | Diamond Pad Conditioner |
