- Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
- Accurately controlled microreplicated structures
- Consistent performance disk-to-disk and the metal-free cutting surface
- Ideal for advanced node processes sensitive to metallic contamination
Details
Bringing together 3M’s know-how in abrasives, ceramics and microreplication, the 3M™ Trizact™ Pad Conditioner B6-1900 is an innovative pad conditioner for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.
- Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
- Accurately controlled microreplicated structures
- Consistent performance disk-to-disk and the metal-free cutting surface
- Ideal for advanced node processes sensitive to metallic contamination
Specifications
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Abrasive Working Surface
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B6-1900 pattern
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Applications
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CMP
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Brand
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Trizact™
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Carrier Colour
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Grey
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Carrier Format
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Stainless steel carrier - with universal mouting configuration
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Carrier Material
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304 Stainless Steel
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Carrier Size
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4.25 inch diameter
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Carrier Substrate
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304 SS
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CMP Process
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AL
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Mineral Type
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CVD coated ceramic
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Product Series
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B6-1900
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Product Type
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Diamond Pad Conditioner
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