3M™ Trizact™ Pad Conditioner B6-1900-5S2, 4.25 in diameter
- Part Number B6-1900-5S2
- 3M ID 60020021667
Details
Highlights
- 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
- Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
- Metal-free composition is ideal advanced node processes sensitive to contamination
- Outstanding disk-to-disk consistency for predictive performance
3M™ Trizact™ Pad Conditioners deliver precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). Diamond-coated ceramic construction is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives.
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Microreplication – when consistency and precision really matter
Featuring precisely-shaped, three-dimensional abrasive structures, 3M™ Trizact™ CMP pad conditioners are ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication – a core 3M technology applied to advanced node semiconductor manufacturing – these structures are reproduced uniformly across the Trizact™ CMP pad conditioner surface. What's more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.
Specifications
Resources
Related Products
| Carrier Diameter (Metric) | 107.95 mm | ||
| CMP Process | STI Process |
