3M™ Diamond Pad Conditioner A98, 4.25-in dia

  • 3M ID 60020014969

Optimized for extended pad and disk life

Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership

Diamonds secured with both chemical and mechanical bonds for great retention

View more details

Specifications

Details

Highlights
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
  • Customizable for conditioning aggressiveness
  • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.