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  6. 3M™ Diamond Pad Conditioner Ring E221, 260-mm dia

3M™ Diamond Pad Conditioner Ring E221, 260-mm dia

3M ID 60020008532
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life
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Details

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life
Specifications
Abrasive Working Surface
Segmented
Aggressiveness
65-75
Applications
CMP
Carrier Colour
Grey
Carrier Format
Ring
Carrier Size
10.24 inch diameter
Carrier Substrate
304 SS
CMP Process
PMD/ILD
Diamond Size
251 um
Diamond Type
Type 4, semi-sharp
Manufacturing Location
United States
Mineral Type
Nickel based alloy with patterned diamond
Product Series
E221