Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
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Abrasive Working Surface
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Ring Face
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Aggressiveness
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1-4
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Applications
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CMP
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Brand
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3M™
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Carrier Colour
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Grey
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Carrier Format
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Disk - with bevel edge
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Carrier Material
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304 Stainless Steel
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Carrier Size
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4.25 inch diameter
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Carrier Substrate
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304 SS
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CMP Process
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Cu (barrier), Cu (bulk)
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Diamond Size
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63 um
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Diamond Type
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Type 2, blocky
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Manufacturing Location
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United States
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Mineral Type
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Nickel based alloy with patterned diamond
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Product Series
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A63
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Product Type
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Diamond Pad Conditioner
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