- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
Details
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
Specifications
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|
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|---|---|
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Abrasive Working Surface
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Ring Face
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Aggressiveness
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1-4
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Applications
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CMP
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Brand
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3M™
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Carrier Colour
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Grey
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Carrier Format
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Disk - with bevel edge
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Carrier Material
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304 Stainless Steel
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Carrier Size
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4.25 inch diameter
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Carrier Substrate
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304 SS
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CMP Process
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Cu (barrier), Cu (bulk)
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|
Diamond Size
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63 um
|
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Diamond Type
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Type 2, blocky
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|
Manufacturing Location
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United States
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Mineral Type
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Nickel based alloy with patterned diamond
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Product Series
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A63
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Product Type
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Diamond Pad Conditioner
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