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  6. 3M™ Electrically Conductive Adhesive Transfer Tape 9711S, 300 mm x 10 m, 100um

3M™ Electrically Conductive Adhesive Transfer Tape 9711S, 300 mm x 10 m, 100um

  • Part Number 9711S
  • 3M ID WX300926879
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Overall Width (Metric) 300 mm
Total Tape Thickness without Liner (metric) 0.1 mm
Overall Length (Metric) 10 Metre
Adhesive Type Acrylic

XYZ-conductivity through the adhesive

Excellent conformability and quick bonding

Good EMI shielding in bond line gap

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Details

Highlights
  • XYZ-conductivity through the adhesive
  • Excellent conformability and quick bonding
  • Good EMI shielding in bond line gap
  • Thicker construction to conform to non-flat surfaces
  • Improved electrical contact to small size areas
  • Good handling and workability
  • Other thicknesses may be available upon request

3M™ Electrically Conductive Adhesive Transfer Tape 9711S is an XYZ-axis electrically conductive pressure sensitive adhesive (CPSA) tape. This double-sided tape has a nickel/copper-coated conductive woven fabric carrier. Designed for EMI shielding and grounding applications, enabling devices to meet electromagnetic compatibility requirements.

  • Icon of lines with multiple thicknesses representing multiple thicknesses.
    Multiple Thicknesses
  • Icon of a line branching out into three lines at a 90-degree angle representing reliable grounding.
    Reliable Grounding
  • Icon of a substrate peeling off of a surface representing strong bond.
    Strong Bond
  • Icon of a circle with lines exiting at every axis representing versatility.
    Versatility
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Product construction
Cross-section of product construction listing the five layers of release liner, conductive adhesive, conductive fabric, conductive adhesive, and the release liner
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  • Cross-section of appropriate product usage with the conductor filler, adhesive and carrier in between two conductive substrates.
  • Product usage

    3M™ Electrically Conductive Double-Sided Tape 9711S delivers a broad spectrum of performance across frequencies in grounding, attaching, passive intermodulation (PIM) management, interconnecting and electrostatic discharge (ESD) applications.
     

    • Printed circuit boards
    • Flexible printed circuits
    • Chassis
    • Sensors
    • EMI shields
    • EMI gaskets
    • Bond line gaps
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Set of icons representing recommended product applications of attaching, electrostatic discharge (ESD), grounding, interconnecting and passive intermodulation (PIM).

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