Machine showing the temporary bonding and debonding process for semiconductor advanced packaging.
Temporary bonding and debonding for advanced packaging

Help customers with their design needs while increasing efficiency in your own processes with 3M temporary bonding and debonding solutions for semiconductor advanced packaging.

3M solutions for semiconductor wafer-level packaging and panel-level packaging

  • In order to meet new computing and design requirements demanded by IoT, 5G, augmented and virtual reality, and other global technology trends, IC manufacturers have turned to advanced packaging solutions to enable high device density integration in reduced footprint and enhance chip performance.

    At 3M, we’ve developed solutions — the 3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series (3M OneFilm) and 3M™ Wafer Support System (3M WSS) — that help customers enable wafer- and panel-level packaging and their sophisticated fan-out wafer- and panel-level counterparts, by addressing their key thermal and chemical resistance challenges.

    3M offers a global team of material experts that are ready to help customers assess and address their specific technical requirements for seamless integration. From initial testing to mass production, our goal is to help you determine process compatibility and deliver timely solutions.

Less defects. More profitability.

  • For more than 100 years, 3M has made product testing an essential part of delivering high-quality solutions — adhesives used for the 3M WSS and 3M OneFilm are no different. Our materials undergo strict adhesion, thermal and chemical resistance testing, so they can withstand new process, time, temperature and substrate requirements needed for fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP).

    We analyze many different material properties, including:

    • Adhesion to silicon and other treated surfaces after application and thermal exposure
    • Chemical resistance to specific processes (electroplating, etc.) and weight loss/gain following wafer immersion for set periods of time and temperatures (polishing, etc.)
    • Weight loss after thermal processing (dielectric cure, plasma, sputtering, etc.)
    • Residue analysis
    • Physical properties of adhesive (modulus, Tg, tensile properties/elongation, etc.)

    For specific thermal, time and chemistry requirements, 3M technical experts can work with you and your team to identify a potential solution with direct support from global product development labs and manufacturing sites.

  • Key trends in semiconductor advanced packaging

    Fan-out wafer-level packaging

    In FOWLP, front-end processed wafers are temporarily bonded to a rigid carrier for support during back-end processing, then debonded from the carrier and diced. Dice are then carefully rearranged on a wafer or panel, which is then molded to fill gaps. The result is a reconstituted wafer (or panel) with space (where gaps have been filled) for “fanned out” connection points.

    Fan-out panel-level packaging

    FOPLP, as its name suggests, takes FOWLP a step further by allowing for packaging and processing dice on a large square panel, which can handle more dice than a wafer, further reducing costs.

    Heterogeneous integration

    Heterogeneous integration takes different components (die, MEMS, sensors, etc.) that have been manufactured in separate processes and combines them into a single overall package. As a result, the package delivers better functionality and operational benefits (system-level performance, ownership costs).

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3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series

3M OneFilm, a groundbreaking film-based solution for panel-level packaging

Target applications: FOWLP, FOPLP, 3D through-silicon vias (TSVs)

  • Get more value out of your wafer- and panel-level packaging manufacturing process with 3M OneFilm, a solution designed specifically to enable the latest fan-out wafer- and panel-level IC packages.

    3M OneFilm, which functions like our 3M WSS spin-coat materials, offers the thermal performance required by FOPLP, so you can boost productivity and drive down costs by producing more chips versus a wafer in the same amount of time.

    Read more about this innovation in our technical whitepaper.


Redistribution layer (RDL)-last FOWLP and FOPLP process flow

  • Graphic showing 3M's OneFilm enabling fan-out wafer-and panel-level-packaging processes.

    A. Molded wafer/panel B. Chip/die C. Glass carrier D. 3M OneFilm E. Passivation F. Solder bump

  • See how 3M OneFilm enables fan-out wafer- and panel-level packaging processes. 3M OneFilm can be used in the reconstitution process, or later as shown here where 3M OneFilm bonds the already-reconstituted wafer from the molding side for an RDL-last process.

    1. Reconstitution and panelization

    2. 3M OneFilm lamination

    • Simple bonding process

    3. Build-up (RDL and solder reflow)

    • Excellent thermal stability (up to 230 degrees Celsius, for 2 hours)

    4. Laser debonds glass carrier

    • Stress-free debonding process

    5. Debonder peels adhesive

    • Easy removal (chemical-free, residue-free)

    6. Final product

Technical data sheets for 3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series

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3M™ Wafer Support System

The 3M WSS — an all-in-one semiconductor wafer-level packaging solution

Target applications: IGBT, FOWLP, LED, MEMS, 3D TSVs, heterogeneous integration

The 3M WSS — a complete IGBT and wafer-level packaging solution — combines world-class equipment with 3M™ Liquid UV-Curable Adhesive to enable the temporary bonding and debonding processes required for wafer thinning and high-temperature FOWLP and FOPLP (with 3M OneFilm) processes.

Temporarily bonding to a glass carrier provides a rigid, uniform support surface that minimizes stress on the wafer during the subsequent processing steps, resulting in less warpage, cracking, edge chipping — and higher yields.

  • Two hands in lab gloves holding a wafer that used 3M's Wafer Support System for semiconductor manufacturing.

    Next steps in 3M WSS innovation

    We’re currently formulating adhesive technology that aims to enable heterogeneous integration by maintaining non-oxide surfaces through ultra-high temperature copper-to-copper bonding processes.

    Reach out to a 3M material expert to learn more about how we’re approaching copper thermocompression and its impact on heterogeneous integration.

    Additional product viability testing for 3M WSS includes:

    • Rheology of spin-coat materials prior to cure
    • UV-cure and time requirements

Temporary bonding and debonding process flow

  • Step-by-step graphic of 3M's temporary bonding and debonding process flow for 3M's Wafer Support System.

    A. Semiconductor wafer B. 3M™ Liquid UV-Curable Adhesive C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink) D. Glass carrier E. 3M™ Wafer De-Taping Tape 3305

  • The 3M WSS brings easy bonding and debonding with high throughput of more than 22 wafers per hour.

    1. Bond the wafer to glass carrier

    • Quick curing without post-thermal curing steps

    2. Backgrinding

    • Good total thickness variation (TTV) after backgrinding (typically 2um TTV for 300mm wafer)

    3. Backside processing

    • Good heat resistance (up to 180 degrees Celcius, for 1 hour)
    • Good chemical resistance to a broad range of process chemistries, low outgas

    4. Dicing tape application

    5. Laser debonding

    6. Glass carrier lift-off

    • Without stress

    7. Peel off UV adhesive layer

    • Easy removal without residue

Technical data sheets for 3M™ Wafer Support System

Connect with a 3M expert about 3M OneFilm and the 3M WSS

We’ve got a team of experts with decades of problem-solving experience and training in relevant technologies ready to help you tackle your toughest material challenges.