3M Trizact CMP Pad with groove design for semiconductor manufacturing
Redefining CMP pads.

Highly repeatable performance and efficiency in semiconductor manufacturing with 3M™ Trizact™ CMP Pads.

  • Innovative groove design of the 3M™ Trizact™ CMP Pad with independent unit cells — shown here as an optical microscope image.

Designed to deliver a predictable, stable, consistent performance to your Chemical Mechanical Planarization process — every time.

With trends like IoT, smart cities, connected transportation, mobile and edge computing driving our world, semiconductors that deliver more memory and speed are in demand. The pressure is on to deliver performance and cost-effective consistency to the Chemical Mechanical Planarization (CMP) process of semiconductor manufacturing. Demand to continually increase yield leaves no room for variation in a fab's production that risks waste or device reliability. 3M is redefining CMP products with our 3M™ Trizact™ CMP Pads to ensure consistent CMP process performance.

  • Advanced node semiconductor manufacturing
    See the new 3M™ Trizact™ CMP pads in action.

    Advanced performance for your advanced nodes.

    Our 3M™ Trizact™ CMP Pads blend 3M’s know-how in molding, surface modification and microreplication, delivering an innovative pad for Chemical Mechanical Polishing for advanced node semiconductor manufacturing.

    • Uses precisely engineered three-dimensional microreplicated asperities and pores to define the pad texture and help ensure consistent performance pad-to-pad — meeting the demands of advance node CMP processes.
    • Asperities and pores are arranged into independent unit cells to enable uniform pressure across the wafer.
    • Our highly controlled microreplication process delivers repeatable and tunable CMP pads.

    View 3M Trizact CMP pads

Trizact CMP Pads in a fab production environment

Reduced variability and increased repeatability — delivering improved yield.

  • Consistency.

    Designed to deliver the CMP performance you need, 3M™ Trizact™ CMP Pads are engineered using our proprietary microreplication process. The result is a pad that is consistent and well characterized helping to ensure that tomorrow’s pad is the same as today’s.

    • Uniformity in the polishing process.
    • Consistent texture from pad to pad.
    • Stability through pad life.
  • Improved yield.

    Consistent and repeatable CMP performance leads to increased yield. 3M™ Trizact™ CMP Pads help increase planarization efficiency, reduce defects, and improve productivity and output.

    • Improved planarization efficiency to enable advanced node CMP.
    • Reduced dishing and erosion.
    • Less pad debris for fewer defects.
  • Reduced consumables.

    Our proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner.

    • Reduced metal contamination risk.
    • Lower cost of ownership.
    • Longer life, less downtime.

  • Microreplicated asperities of the Trizact CMP Pad
    Precisely engineered 3-dimensional microreplicated asperities of the 3M™ Trizact™ CMP Pad.

    Microreplication — uniformity at the most microscopic level.

    At the core of the 3M™ Trizact™ CMP Pad is one of 3M’s core technology platforms — microreplication. This technology allows us to deliver excellent uniformity to surfaces with precisely sculpted microscopic features. While this technology was originally born to deliver light management properties to overhead projectors, it has since been extended to tens of thousands of 3M products.

Technical paper published by The Electrochemical Society (ECS), August 2016

A Microreplicated Pad for Tungsten Chemical-Mechanical Planarization

  • Microreplication in Chemical Mechanical Planarization with 3M CMP Pads
    WIDNU based on gate height and TS dielectric thickness

    Within-die non-uniformity (WIDNU) determined by gate height range among 3 different devices, and by the range in dielectric thickness on top of gate (i.e., TS dielectric) between 3 different devices. One center die, one middle die, and one edge die from wafers polished with POR and MR pads are submitted for cross-sectional TEM analysis, from which gate height and dielectric thickness measurements are taken.

  • Authors: Wei-Tsu Tseng, Kaushik Mohan, Ricky Hull, James Hagan, Connie Truong, Duy K. Lehuu, and David Muradian

    A microreplicated (MR) pad with regulated long-range order surface pore-asperity patterns is used for the buff polish step in a 3-platen W-CMP process for 14 nm replacement metal gate (RMG) and trench salicide (TS) planarization. This new pad requires no diamond tip conditioner and can last up to 2000 wafer passes with highly repeatable removal rates, while maintaining low and consistent defects and within-wafer uniformity. The MR pad also provides unique benefits of mitigating within-die non-uniformity as demonstrated by gate electrical conductance tests and confirmed by physical thickness measurement through cross-sectional TEM.

    In addition, topography-driven defects are reduced significantly. The mechanisms responsible for the unique performance of MR pads will be elucidated and the significance of this new CMP pad technology will be discussed.

Technical paper published by Institute of Electrical and Electronics Engineers (IEEE), May 2017

Microreplicated CMP Pad for RMG and MOL Metallization

  • Groove design of the 3M Trizact CMP Pad magnified
    Innovative groove design of 3M™ Trizact™ CMP pad – SEM image at 35x magnification

    Authors: Wei-Tsu Tseng, Changhong Wu, James Hagan, Yanni Wang, Hong Lin, Ja-Hyung Han, Dinesh Koli

    With advanced nodes selecting cobalt for more and more layers, it is becoming a greater challenge to maintain within-die non-uniformity for control or gate height and trench height. Read more about the 3M™ Trizact™ CMP Pad for Cobalt buff CMP defectivity and topography performance presented by Global Foundries at the 2017 IEEE International Interconnect Technology Conference (IITC).

Redefining the CMP Process with 3M Science
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