Thanks to their enhanced thermal management capabilities, these materials are enabling a new generation of electrical and electronic components that offer improved performance, reliability and energy savings.
3M™ Boron Nitride Cooling Fillers are a versatile family of ceramic fillers that improve the thermal conductivity of polymers while maintaining electrical insulation. Designed to meet the increasing need for “smart” polymers, these fillers can be formulated into many thermoplastics, elastomers, thermoset resins and adhesives. They help dissipate heat in consumer electronics and improve thermal management efficiency in high-capacity batteries, LEDs and automotive applications. By functionally integrating thermal management with electrical insulation, boron nitride-filled compounds may even enable lighter, simpler component designs – which can reduce total system costs.
3M’s application engineering team has the experience and technical expertise to help customers optimize their formulations to take advantage of the unique properties of boron nitride cooling fillers.
Browse our library of case studies to learn how 3M Boron Nitride Cooling Fillers can boost the thermal conductivity of existing compounds, how processing factors influence performance, and more.
Preferred for thin films <25 μm and fibers, fine channels and windings. CFP 003SF has a controlled top size.
Optimal all-purpose grades for pads and injection molded parts.
Ideal for thin films <50 μm due to its controlled top size. Highest reflectivity and increased in-plane thermal conductivity in pads.
Spray-dried boron nitride platelets for excellent processability, flowability and high dosing velocities for extruded and injection molded parts.
Soft agglomerates for high filler loadings. Excellent processability, flowability and high dosing velocities. Best fit for silicone TIMs.
Mix of agglomerates, platelets and boron nitride clusters. Excellent for potting resins.
Highest through-plane thermal conductivity. Boosts thermal conductivity of compounds as secondary filler.
Preferred for lowest viscosity in epoxies and silicones. High thermal conductivity.
|Zero records found|
Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)
* Particle size distribution measured by laser light scattering (Mastersizer 2000, dry, 0.1 bar)
** Data determined by means of SEM pictures
*** Can include soft agglomerates with 50-100µm
For calculation purpose: Density of bulk hBN 2.25 g/cm³
3M Center, 280-01W-03
St. Paul, MN 55144-1000
Santa Fe 190, Col. Santa Fe, Deleg. Alvaro Obregon
Mexico D.F., C.P. 01210
0052-5552700-400 ext 82935
Via Anhanguera km, 110
Sumare, Sao Paulo
CEP 13181-900, Brasil
3M Advanced Materials Division
Boulevard de l’Oise
95006 Cergy Pontoise
+33 1 30 31 62 10
3M Technical Ceramics
Zweigniederlassung der 3M Deutschland GmbH
Max-Schaidhauf-Str. 25, 87439 Kempten
Phone: +49 (0)8315618-0
Advanced Materials Division
Via N. Bobbio, 21 – Pioltello
+39 02 7035 1
Al Khobar Office
13th Floor, Alothman Holding Tower, King Saud Road, Alqashlah
Alkhobar, 31952 Saudi Arabia
+966 13 8323930
3M Gulf Ltd.
Bldg. No.11, 3rd Floor
Dubai Internet City
Dubai, United Arab Emirates
Krylatsky Hills Business Park
+7 (495) 784-74-74
38/F Maxdo Centre ,No.8 Xing Yi Road, 200336,
19F, 82, Uisadang-daero,
Seoul, 07321, Korea
Shinagawa-ku, Tokyo 141-8684
6F, No.95, Sec.2
Dunhua S. Rd., Taipei 10682
10 Ang Mo Kio Street 65
Perkantoran Hijau Arkadia Tower F, 8th Floor
Jl. TB Simatupang Kav.88
Jakarta Selatan 12520
Thank you for your interest in 3M Boron Nitride Cooling Fillers. A 3M representative will contact you shortly regarding your inquiry.
An error has occurred while submitting. Please try again later...