- Overview
- PRODUCTS
- Advanced Ceramics
- Ceramic Microspheres
- Fluoroelastomers
- Fluorothermoplastics
- Fluoropolymers
- Glass Bubbles
- Dyneon PTFE
- Ionomers
- View All
- CAPABILITIES
- Assembly Improvement
- Chemical and Temperature Resistance
- Custom Compounding
- Lightweighting
- Permeation Resistance
- Production Efficiency
- Surface Protection
- Thermal Management
- View All
- Support
3M™ Boron Nitride Cooling Fillers for thermally conductive and electrically insulating plastics and adhesives.
-
Thanks to their enhanced thermal management capabilities, these materials are enabling a new generation of electrical and electronic components that offer improved performance, reliability and energy savings.
3M™ Boron Nitride Cooling Fillers are a versatile family of ceramic fillers that improve the thermal conductivity of polymers while maintaining electrical insulation. Designed to meet the increasing need for “smart” polymers, these fillers can be formulated into many thermoplastics, elastomers, thermoset resins and adhesives. They help dissipate heat in consumer electronics and improve thermal management efficiency in high-capacity batteries, LEDs and automotive applications. By functionally integrating thermal management with electrical insulation, boron nitride-filled compounds may even enable lighter, simpler component designs – which can reduce total system costs.
3M’s application engineering team has the experience and technical expertise to help customers optimize their formulations to take advantage of the unique properties of boron nitride cooling fillers.
-
Features and Benefits
- High thermal conductivity
- Electrical insulation
- Low density
- High reflectivity
- Excellent dry lubrication
- Gentle on tooling for compounding, extrusion and injection molding processes
-
Potential Applications
- Thermal interface materials (TIM) and heat sinks for consumer electronics and high-capacity batteries in automotive electrification
- Housings for electronic components in electric and hybrid vehicles
- LEDs for street and interior lighting
- Thermally-conductive adhesives and greases
- Motors, generators and transformers
How It Works
-
Browse our library of case studies to learn how 3M Boron Nitride Cooling Fillers can boost the thermal conductivity of existing compounds, how processing factors influence performance, and more.
3M™ Boron Nitride Cooling Fillers - Grade Profiles
-
3M™ Boron Nitride Cooling Filler Platelets CFP 001 and 003SFPreferred for thin films <25 μm and fibers, fine channels and windings. CFP 003SF has a controlled top size.
-
3M™ Boron Nitride Cooling Filler Platelets CFP 003E, 003, 006, 0075, 009 and 012Optimal all-purpose grades for pads and injection molded parts.
-
3M™ Boron Nitride Cooling Filler Platelets CFP 007HSIdeal for thin films <50 μm due to its controlled top size. Highest reflectivity and increased in-plane thermal conductivity in pads.
-
3M™ Boron Nitride Cooling Filler Granulated Platelets CFP 012PSpray-dried boron nitride platelets for excellent processability, flowability and high dosing velocities for extruded and injection molded parts.
-
3M™ Boron Nitride Cooling Filler Agglomerates CFA 250SSoft agglomerates for high filler loadings. Excellent processability, flowability and high dosing velocities. Best fit for silicone TIMs.
-
3M™ Boron Nitride Cooling Filler Agglomerates CFA 50MMix of agglomerates, platelets and boron nitride clusters. Excellent for potting resins.
-
3M™ Boron Nitride Cooling Filler Flakes CFF 500-3 and 200-3Highest through-plane thermal conductivity. Boosts thermal conductivity of compounds as secondary filler.
-
3M™ Boron Nitride Cooling Filler Flakes CFF 500-15 and 200-15Preferred for lowest viscosity in epoxies and silicones. High thermal conductivity.
Powder Characteristics
-
Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)* Particle size distribution measured by laser light scattering (Mastersizer 2000, dry, 0.1 bar)
** Data determined by means of SEM pictures
*** Can include soft agglomerates with 50-100µm
For calculation purpose: Density of bulk hBN 2.25 g/cm³
3M Boron Nitride Cooling Fillers Technical Documents
Filler Finder
-
Many factors can impact the thermal properties of your system, so where do you start? Our online filler finder selector tool can help.
3M Boron Nitride Cooling Fillers Videos and Educational Materials
Support
Contact us if you need product, technical or application advice or want to collaborate with a 3M Technical Specialist.
Call 1800-425-3030 (Mon-Fri, 8:00 AM – 5:00 PM Central Time )
Thank You
Thank you for your interest in 3M Boron Nitride Cooling Fillers. A 3M representative will contact you shortly regarding your inquiry.
Our Apologies...
An error has occurred while submitting. Please try again later...
Featured Product
